| Question |
Answer |
| What type of defect can it detect |
At least things picked up by normal
operator visual inspection, dirt, scratched etc. But also can detect
batch to batch inconsistencies or missing layers etc. |
| What is the minimum defect size |
Very dependent on wafer and type
of defect. Normally from 3um and above but can go smaller. Need
samples in most cases. |
Can it work with any prober ? -
Even Semi-Automatic ? |
Normally Yes - In its raw form
chip-check uses the prober just for positioning. With the added
software and mapping functionality it can integrate right on to an automatic
test floor. |
| Can I exclude certain areas like probe
pads ? |
Yes - we have multiple selection and block-out
zones - INCLUDING ROUND shapes. |
| Can I look for different things across
the field of view ? |
Yes - we have different sensitivities
for different areas |
| Can it do defect Characterization
or classification ? |
Partially - you can determine what type
of defect normally by its size or location. repeat defects or
scratches can be integrated with the "SMART SAMPLE" capability. |
| Does it take long to inspect a wafer ? |
By far the longest delay is in the
stepping of the prober. Image capture and analysis is very fast. Sample
and smart sample mode also increases throughput. |
| Is there review capability
? |
Yes - several types. Images can be
stored or the system can be run to re-visit failed die to allow
manual acceptance and override. The settings can then be added to
the detection criteria if required |
| Is it recipe driven ? |
Yes and can be linked into OCR or other
system. Wafer type information is stored with the setup. The
parameters are just like another parameters in a test program. |
